IEC 62769-1 Ed. 3.0 b:2023

  • standard by International Electrotechnical Commission, 04/01/2023
  • Field device integration (FDI) - Part 1: Overview
  • Category: IEC

$234.00 $117.00

Full Description

This part of IEC 62769 describes the concepts and overview of the Field Device Integration (FDI®1) specifications. The detailed motivation for the creation of this technology is also described (see 4.1). Reading this document is helpful to understand the other parts of this multipart standard.

Product Details

Edition:
3.0
Published:
04/01/2023
ISBN(s):
9782832264416
Number of Pages:
64
File Size:
1 file , 1.5 MB
Note:
This product is unavailable in Ukraine, Russia, Belarus

Document History

IEC 62769-1 Ed. 3.0 b:2023

IEC 62769-1 Ed. 1.0 b:2015

IEC 60238 Ed. 9.1 b:2017

IEC 60238 Ed. 9.1 b:2017

Edison screw lampholders CONSOLIDATED EDITION..

$291.00 $582.00

IEC 60238 Amd.1 Ed. 9.0 b:2017

IEC 60238 Amd.1 Ed. 9.0 b:2017

Amendment 1 - Edison screw lampholders..

$13.00 $25.00

IEC 60747-4 Amd.1 Ed. 2.0 b:2017

IEC 60747-4 Amd.1 Ed. 2.0 b:2017

Amendment 1 - Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors..

$13.00 $25.00

IEC 60747-4 Ed. 2.1 b:2017

IEC 60747-4 Ed. 2.1 b:2017

Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors CONSOLIDATED EDI..

$329.00 $658.00