IEC 62769-4 Ed. 3.0 b:2023
- standard by International Electrotechnical Commission, 04/01/2023
- Field Device Integration (FDI) - Part 4: FDI Packages
- Category: IEC
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Full Description
This part of IEC 62769 specifies the FDI®1 Packages. The overall FDI® architecture is illustrated in Figure 1. The architectural components that are within the scope of this document have been highlighted in this figure.
Product Details
- Edition:
- 3.0
- Published:
- 04/01/2023
- ISBN(s):
- 9782832267943
- Number of Pages:
- 186
- File Size:
- 1 file , 3 MB
- Note:
- This product is unavailable in Ukraine, Russia, Belarus
Document History
